Resistor Paste

The wide range of thick film resistor materials from DuPont for use in hybrid applications gives application designers the reliability and performance they need. The blendable series of materials offers targeted resistance values in all applications. Offering improved temperature coefficient of resistance (TCR) control, a wide process window, and minimum and controlled termination effects, thick film resistor materials for use in hybrid applications from DuPont provide excellent environmental stability.

Conductor Paste

Designed to deliver the best reliability/performance vs. system level cost, these materials enable more cost-effective manufacturing processes, including fine line printing, 30 or 60 minute firing profiles, co-fireability and unprecedented field reliability.

Dielectric & Encapsulant Material

These materials are designed to deliver the best reliability/performance vs. system level cost, enabling more cost-effective manufacturing processes including fine-line printing, 30 or 60 minute firing profiles, co-fireability and unprecedented field reliability.

Photoimageable Material

The Fodel™ photo defined thick film ceramic system, featuring dielectric, silver and gold conductors, combines the best and most cost-effective photolithography processes used in electronics today with the performance and reliability of thick film ceramics. The resulting combination enables the creation of high density/fine line/fine geometry circuits, ideal for the most challenging applications and toughest operating environments, all while keeping production costs low.